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DF6A6.8FUT
Quad Array for
ESD Protection
This quad voltage suppressor is designed for applications requiring
transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers,
business machines, communication systems, medical equipment, and
other applications. Its quad junction common anode design protects
four separate lines using only one package. These devices are ideal for
http://onsemi.com
situations where board space is at a premium.
1
6
68 M G
G
Specification Features
? SC ? 88 Package Allows Four Separate Unidirectional Configurations
? Low Leakage < 1 m A @ 5 Volt
? Breakdown Voltage: 6.4 ? 7.2 Volt @ 5 mA
? Low Capacitance (40 pF typical)
? ESD Protection Meeting 61000 ? 4 ? 2 Level 4
and 16 kV Human Body Model
? These are Pb ? Free Devices
Mechanical Characteristics
? Void Free, Transfer ? Molded, Thermosetting Plastic Case
? Corrosion Resistant Finish, Easily Solderable
? Package Designed for Optimal Automated Board Assembly
? Small Package Size for High Density Applications
2 5
3 4
MARKING
DIAGRAM
1 6
SC ? 88
CASE 419B ? 02
1
68 = Specific Device Code
M = Date Code
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
Rating Symbol Value
Unit
G = Pb ? Free Package
(Note: Microdot may be in either location.)
Peak Power Dissipation @ 8 x 20 m s
(Note 1)
P pk
75
Watts
ORDERING INFORMATION
Steady State Power Dissipation
(Note 2)
Thermal Resistance ?
Junction ? to ? Ambient
Derate Above 25 ° C
P D
R q JA
385
328
3.0
mW
° C/W
mW/ ° C
Device
DF6A6.8FUT1G
DF6A6.8FUT2G
Package
SC ? 88
(Pb ? Free)
SC ? 88
(Pb ? Free)
Shipping ?
3000/Tape & Reel
3000/Tape & Reel
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
ESD Discharge
MIL STD 883C ? Method 3015 ? 6
T Jmax
T J , T stg
V PP
150
? 55 to
+150
16
° C
° C
kV
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
IEC61000 ? 4 ? 2, Air Discharge
IEC61000 ? 4 ? 2, Contact Discharge
16
8
Lead Solder Temperature
(10 seconds duration)
T L
260
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Per Waveform Figure 1
2. Mounted on FR ? 5 Board = 1.0 X 0.75 X 0.062 in.
? Semiconductor Components Industries, LLC, 2012
October, 2012 ? Rev. 2
1
Publication Order Number:
DF6A6.8FUT1/D
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